A cutting device developed specifically for carbon fiber materials, capable of cutting, drilling and grooving composite materials such as carbon fiber, glass fiber and Kevlar. It can handle materials with a thickness ranging from 0.05mm to 1mm, and is applicable to the processing of display backplanes, mobile phone back shells, AR glasses shells, etc
Adopting high-end ultra-fast laser, it enables non-carbonization and non-ablation separation of materials, eliminating the need for complicated post-processing. It features stress-free processing, minimal thermal influence, accurate and controllable cutting depth and width, as well as high precision and high yield rate.
Imported optical components are adopted, ensuring reliable quality and low power loss