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Ceramic Dual-Hole Laser Cutting Machine

This equipment is mainly used for the precision processing of LTCC green ceramics, HTCC green ceramics, ferrites and other materials, including via drilling, blind via drilling, stripping, removal, cutting, cavity milling and marking.

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13556305903

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应用领域

Ceramic Inductors, LTCC, HTCC

上一款产品：

IC Substrate Laser Drilling Equipment

本设备主要用于PCB载板激光钻孔、材料开窗、表面研磨等。超快激光加工热影响区小、加工边缘光滑，适配PCB/FPC、玻璃基…… 下一款产品：

PCB Laser Cutting Machine

本设备用于PCB电路板，HDI板，IC载板等微孔加工。