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Slit Coating Equipment

This equipment is an automated production line integrating a high-precision slot die coater, a heating vacuum curing and drying (HVCD) furnace, and a precision pre-curing furnace, which realizes the integrated processing of the entire coating-drying-curing workflow.

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设备简介

Automated production line for high-precision slit coaters, heating vacuum conduction drying (HVCD) furnaces, and high-precision pre-curing (HP) furnaces.
10双龙门涂布.pngHVCD.pngHP涂布固化工艺设备.png
slit coaterHVCDHP


应用领域

Fully covering advanced packaging technology nodes including TGV (Through Glass Via), 2.5D/3D IC, FOPLP (Fan-Out Panel Level Packaging) and Chiplet.



设备特点
产品加工尺寸：
半导体封装太阳能光伏
600mmx600mm
510mmx515mm
310mmx310mm		2400mm×1200mm

1200mm×600mm

600mm×600mm

平板显示研发机

G8.6 2290mm×2620mm

G6 1500mmx1850mm

G5 1100mmx1300mm

G4.5 730mmx920mm

G3.5 620mm×750mm

G3 550mm×650mm

300mm×400mm
200mm×200mm
100mm×100mm




设备参数

1

产品尺寸
Product Dimensions

510mm*515mm

730mm*920mm

2

基板厚度
Substrate Thickness

0.3~2mm

3

干膜厚度
Dry Film Thickness

0.2-25um

4

涂布速度
Coating Speed

100mm/s



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