Full-Automatic TFT Laser Cutting Machine

Used for cutting TFT due to process requirements. Using picosecond infrared laser, optical path shaping technology, and focused wire technology, the beam diameter is as small as 1-2um, which will not damage the TFT circuit

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Full-Automatic TFT Laser Cutting Machine
Full-Automatic TFT Laser Cutting Machine
Full-Automatic TFT Laser Cutting Machine

It is designed for the cutting of TFT panels as required by manufacturing processes. Adopting a picosecond infrared laser, optical path shaping technology and focused filamentation technology, it achieves a laser beam diameter as small as 1–2 μm without damaging the TFT circuits.

● Ultra-fine laser beam, no damage to TFT

● Optional AOI visual inspection

● Optional ultrasonic cleaving or mechanical cleaving

● Dual-channel design for high cutting throughput

● Smooth edges with no taper

● Robotic automatic loading and unloading

● Fully automated cutting process


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Product Application

This device is suitable for industries such as mobile phone panels and car panels.
Sample Display

Technical parameters

project Technical parameters
Device Model T series
laser power 20W/3OW
laser wavelength Infrared
pulse width femtosecond
Laser lifetime Greater than or equal to 20000 hours
Repetitive positioning accuracy ≤±2μm
minimum line width 2μm
Heat-affected zone ≤50μm
Edge collapse quantity ≤50μ m
Residue level ≤50μ m
Platform maximum speed 1200mm/s
Maximum acceleration of the platform 12000mm/s
Machine control system software Laser Studio8 (Integrated Vision, Laser, and Motion)
Support file formats Common file formats such as DXF Geber Gcode
Environmental Requirements Temperature 22 ℃~25 ℃, humidity<55%
electricity demand 380V50Hz

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FAQ


The wafer splitting machine equipment is used for the splitting process after laser cutting of wafers, with fully automated production. It can automatically identify and operate chips such as mirror, roughening, PSS, back metal plating, DBR chip processes, and ensure a splitting yield of over 98%.


A cutting device developed for large-format transparent and brittle materials, with a cutting range of 600mm×700mm.


  • A cutting device developed specifically for carbon fiber materials, capable of cutting, drilling and grooving composite materials such as carbon fiber, glass fiber and Kevlar. It can handle materials with a thickness ranging from 0.05mm to 1mm, and is applicable to the processing of display backplanes, mobile phone back shells, AR glasses shells, etc

  • A cutting device developed specifically for carbon fiber materials, capable of cutting, drilling and grooving composite materials such as carbon fiber, glass fiber and Kevlar. It can handle materials with a thickness ranging from 0.05mm to 1mm, and is applicable to the processing of display backplanes, mobile phone back shells, AR glasses shells, etc

  • A cutting device developed specifically for carbon fiber materials, capable of cutting, drilling and grooving composite materials such as carbon fiber, glass fiber and Kevlar. It can handle materials with a thickness ranging from 0.05mm to 1mm, and is applicable to the processing of display backplanes, mobile phone back shells, AR glasses shells, etc

  • Wide temperature-controlled process window, compatible with low to high temperature ranges; enables constant-rate etching to ensure stability and consistency in batch processing
  • Long chemical solution service life, eliminating the need for frequent replacement and reducing operational costs
This device supports regular characters, one-dimensional/two-dimensional codes, and 59mm、1018Marking with mm dot matrix pattern. The marking font can be scaled based on SEMI standards, and the character content can be flexibly customized. It is equipped with dual modes of ID wafer edge marking and DIE single-chip independent marking, suitable for precision wafer marking processing.