TGV Laser Drilling Equipment

This device can achieve millions to tens of millions of micro hole processing on panel level and wafer level glass substrates, with features such as high aspect ratio, smooth sidewalls, good verticality, and low cost.

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TGV Laser Drilling Equipment
TGV Laser Drilling Equipment
TGV Laser Drilling Equipment
TGV


  • Wide temperature-controlled process window, compatible with low to high temperature ranges; enables constant-rate etching to ensure stability and consistency in batch processing
  • Long chemical solution service life, eliminating the need for frequent replacement and reducing operational costs

  • Ultrafast Laser Pulse Machining
  • Capable of machining through holes, blind holes, shaped holes, single holes and cluster array holes
  • High roundness of micro-holes, adjustable taper (waist-to-diameter ratio)
  • Surface roughness of through-hole sidewalls ≤ 150 nm
  • Industry-leading aspect ratio up to 200:1
  • Supports DXF file import, compatible with drawings containing up to 100 million holes; AI algorithm automatically plans the optimal machining path
  • Ultra-high machining speed of 10,000 holes per second

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Product Application


Applicable to: 3D heterogeneous integration and advanced packaging, new display, 5G/6G high-frequency RF modules, MEMS and other fields
Sample Display

Technical parameters


Item
Technical Parameters
Model
G6006
Stage Accuracy
Repeatability ±1μm, Positioning Accuracy ±2μm
Stage Travel Speed
≤1000mm/s
Stage Acceleration
≤10000mm/s²
Drilling Efficiency
Max. 10,000 holes per second
Aperture Size
2–200μm
Hole Wall Roughness
-
Waist-to-Diameter Ratio
Adjustable from 60% to 95%
Stage Processing Size
510mm×515mm, Max. Support 730mm×920mm
Processable Glass Thickness
0.2-1.5mm
Max. Aspect Ratio
200:1
Applicable Products
Glass Wafers, Glass Substrates
Applicable Materials
Alkali-free Glass, Aluminosilicate Glass, Fused Silica, Synthetic Silica, etc.

Minimum aperture of 1.5um+maximum aspect ratio of 200:1

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FAQ


The wafer splitting machine equipment is used for the splitting process after laser cutting of wafers, with fully automated production. It can automatically identify and operate chips such as mirror, roughening, PSS, back metal plating, DBR chip processes, and ensure a splitting yield of over 98%.


A cutting device developed for large-format transparent and brittle materials, with a cutting range of 600mm×700mm.


  • A cutting device developed specifically for carbon fiber materials, capable of cutting, drilling and grooving composite materials such as carbon fiber, glass fiber and Kevlar. It can handle materials with a thickness ranging from 0.05mm to 1mm, and is applicable to the processing of display backplanes, mobile phone back shells, AR glasses shells, etc

  • A cutting device developed specifically for carbon fiber materials, capable of cutting, drilling and grooving composite materials such as carbon fiber, glass fiber and Kevlar. It can handle materials with a thickness ranging from 0.05mm to 1mm, and is applicable to the processing of display backplanes, mobile phone back shells, AR glasses shells, etc

  • A cutting device developed specifically for carbon fiber materials, capable of cutting, drilling and grooving composite materials such as carbon fiber, glass fiber and Kevlar. It can handle materials with a thickness ranging from 0.05mm to 1mm, and is applicable to the processing of display backplanes, mobile phone back shells, AR glasses shells, etc

  • Wide temperature-controlled process window, compatible with low to high temperature ranges; enables constant-rate etching to ensure stability and consistency in batch processing
  • Long chemical solution service life, eliminating the need for frequent replacement and reducing operational costs
This device supports regular characters, one-dimensional/two-dimensional codes, and 59mm、1018Marking with mm dot matrix pattern. The marking font can be scaled based on SEMI standards, and the character content can be flexibly customized. It is equipped with dual modes of ID wafer edge marking and DIE single-chip independent marking, suitable for precision wafer marking processing.