Full-Automatic Film Removal, Cutting and Cleaving Equipment

This equipment is mainly designed for laser film removal of gold fingers, laser precision cutting and cleaving, and is also suitable for cutting, drilling and other processes of various optical glass and similar materials.

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Full-Automatic Film Removal, Cutting and Cleaving Equipment

设备简介

应用领域

It is widely applicable to the electronic manufacturing field, undertaking laser film removal, precision cutting and cleaving processes for PCB gold fingers. It is also adapted to optical device processing scenarios, enabling high-precision cutting and drilling operations for various types of optical glass, and empowering the efficient production of consumer electronics, optical instruments and other industries.

设备特点

1、大理石平台平面度：±0.02mm

2、平台规格：3900mm(Y) X 2800mm(X)

3、移动速度：≤1000mm/s（最快）

定位精度： ≤ ±5um

重复定位精度：≤ ±3um

设备参数