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Full-Automatic Film Removal, Cutting and Cleaving Equipment


This equipment is mainly designed for laser film removal of gold fingers, laser precision cutting and cleaving, and is also suitable for cutting, drilling and other processes of various optical glass and similar materials.

Consultation Hotline：
13556305903

Online Customer Service
Application Areas

It is widely applicable to the electronic manufacturing field, undertaking laser film removal, precision cutting and cleaving processes for PCB gold fingers. It is also adapted to optical device processing scenarios, enabling high-precision cutting and drilling operations for various types of optical glass, and empowering the efficient production of consumer electronics, optical instruments and other industries.



Features of the equipment

1、大理石平台平面度：±0.02mm

2、平台规格：3900mm(Y) X 2800mm(X)

3、移动速度：≤1000mm/s（最快）

     定位精度： ≤ ±5um

      重复定位精度：≤ ±3um



Device Parameters
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