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PCB Laser Cutting Machine

This equipment integrates a high-power laser, a precision optical system, a high-precision motion platform, a scanning control system, a CCD positioning system and a platform control into a single unit. It is compatible with various types of lasers including infrared femtosecond/picosecond lasers, ultraviolet picosecond/nanosecond lasers, and green lasers, covering the current mainstream laser applications featuring high peak power and short pulse width.

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设备简介


应用领域

High-precision processing of LCP, FPC, PCB, rigid-flex boards, FR4, CVL, PI decapping and other materials.



设备特点

1. 无应力，热影响小

2. 深度宽度准确可控

3. 高精度，高良率




设备参数

不同配置可选Optional Configurations：

Item

Technical Parameters

Processing Range

G5

G6

G8

Processing Range

350*550mm

550mm*650mm

550mm*650mm

Laser Power

15W/20W/25W/30W/60W

Laser Wavelength

Infrared/Green/UV (Optional)

Pulse Width

Nanosecond/Picosecond/Femtosecond



上一款产品：

Ceramic Dual-Hole Laser Cutting Machine

本设备主要用于LTCC生瓷、HTCC生瓷 、铁氧体等材料通孔、半通孔、剥离、去除、切割 、开腔、标记等精密加工 下一款产品：

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