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PCB Laser Cutting Machine

This equipment integrates a high-power laser, a precision optical system, a high-precision motion platform, a scanning control system, a CCD positioning system and a platform control into a single unit. It is compatible with various types of lasers including infrared femtosecond/picosecond lasers, ultraviolet picosecond/nanosecond lasers, and green lasers, covering the current mainstream laser applications featuring high peak power and short pulse width.

Consultation Hotline：
13556305903

Online Customer Service
Application Areas

High-precision processing of LCP, FPC, PCB, rigid-flex boards, FR4, CVL, PI decapping and other materials.



Features of the equipment

1. 无应力，热影响小

2. 深度宽度准确可控

3. 高精度，高良率




Device Parameters

不同配置可选Optional Configurations：

Item

Technical Parameters

Processing Range

G5

G6

G8

Processing Range

350*550mm

550mm*650mm

550mm*650mm

Laser Power

15W/20W/25W/30W/60W

Laser Wavelength

Infrared/Green/UV (Optional)

Pulse Width

Nanosecond/Picosecond/Femtosecond



上一款产品：

Ceramic Dual-Hole Laser Cutting Machine

本设备主要用于LTCC生瓷、HTCC生瓷 、铁氧体等材料通孔、半通孔、剥离、去除、切割 、开腔、标记等精密加工 下一款产品：

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