Mini LED wafer cutting machine

Using dual path ultrafast lasers for invisible cutting, cutting with MiniLED backlight and direct display chips, and cutting with LED lighting chips.

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Mini LED wafer cutting machine
Mini LED wafer cutting machine
Mini LED wafer cutting machine

Using dual path ultrafast lasers for invisible cutting, cutting with MiniLED backlight and direct display chips, and cutting with LED lighting chips. ● Fully automatic operation, invisible cutting

● Ultra high machining accuracy

● Diagonal crack direction detection to prevent accidental cutting

Multi focal cutting, with good straightness of the fragments and extremely small oblique splitting angles

Smooth side walls and good electrical performance of the product

● Suitable for 4-8 inch Mini LED wafers

● Stable operation and easy maintenance


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Technical parameters

project

Technical parameters

Device Model

G6002

laser

1064nm  5W   ≦10ps

Laser lifespan

≥ 20000 hours

Platform accuracy

Repetition accuracy ± 0.5um, positioning accuracy ± 1um@20 ℃±1℃

Platform operating speed

Running speed 800mm/s, maximum speed 1000mm/s

Platform operating acceleration

Operating acceleration 1.8G, maximum acceleration 2.5G

Platform cutting range

300*300mm

Adapt to product size

4-8 inch wafer

Adapt to materials

Sapphire ≤ 0.5mm, glass, quartz ≤ 1.2mm

Control and software

LASER STUDIO， Integrating vision, laser, and motion

Equipment weight

2500kg

MiniLED backlight and direct display chip cutting, LED lighting chip cutting

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FAQ


The wafer splitting machine equipment is used for the splitting process after laser cutting of wafers, with fully automated production. It can automatically identify and operate chips such as mirror, roughening, PSS, back metal plating, DBR chip processes, and ensure a splitting yield of over 98%.


A cutting device developed for large-format transparent and brittle materials, with a cutting range of 600mm×700mm.


  • A cutting device developed specifically for carbon fiber materials, capable of cutting, drilling and grooving composite materials such as carbon fiber, glass fiber and Kevlar. It can handle materials with a thickness ranging from 0.05mm to 1mm, and is applicable to the processing of display backplanes, mobile phone back shells, AR glasses shells, etc

  • A cutting device developed specifically for carbon fiber materials, capable of cutting, drilling and grooving composite materials such as carbon fiber, glass fiber and Kevlar. It can handle materials with a thickness ranging from 0.05mm to 1mm, and is applicable to the processing of display backplanes, mobile phone back shells, AR glasses shells, etc

  • A cutting device developed specifically for carbon fiber materials, capable of cutting, drilling and grooving composite materials such as carbon fiber, glass fiber and Kevlar. It can handle materials with a thickness ranging from 0.05mm to 1mm, and is applicable to the processing of display backplanes, mobile phone back shells, AR glasses shells, etc

  • Wide temperature-controlled process window, compatible with low to high temperature ranges; enables constant-rate etching to ensure stability and consistency in batch processing
  • Long chemical solution service life, eliminating the need for frequent replacement and reducing operational costs
This device supports regular characters, one-dimensional/two-dimensional codes, and 59mm、1018Marking with mm dot matrix pattern. The marking font can be scaled based on SEMI standards, and the character content can be flexibly customized. It is equipped with dual modes of ID wafer edge marking and DIE single-chip independent marking, suitable for precision wafer marking processing.