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TGV Laser Drilling Equipment


  • Wide temperature-controlled process window, compatible with low to high temperature ranges; enables constant-rate etching to ensure stability and consistency in batch processing
  • Long chemical solution service life, eliminating the need for frequent replacement and reducing operational costs

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设备简介


应用领域

Applicable to: 3D heterogeneous integration and advanced packaging, new display, 5G/6G high-frequency RF modules, MEMS and other fields

设备特点



设备参数

Item
Technical Parameters
Model
G6006
Stage Accuracy
Repeatability ±1μm, Positioning Accuracy ±2μm
Stage Travel Speed
≤1000mm/s
Stage Acceleration
≤10000mm/s²
Drilling Efficiency
Max. 10,000 holes per second
Aperture Size
2–200μm
Hole Wall Roughness
-
Waist-to-Diameter Ratio
Adjustable from 60% to 95%
Stage Processing Size
510mm×515mm, Max. Support 730mm×920mm
Processable Glass Thickness
0.2-1.5mm
Max. Aspect Ratio
200:1
Applicable Products
Glass Wafers, Glass Substrates
Applicable Materials
Alkali-free Glass, Aluminosilicate Glass, Fused Silica, Synthetic Silica, etc.


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