Vacuum drying equipment (VCD)

This equipment is specially designed for precision coating matching processes, which can efficiently achieve uniform and stable drying and curing of the coating film layer. The matching coating production line realizes a closed-loop process for the entire process.

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Vacuum drying equipment (VCD)
Vacuum drying equipment (VCD)
Vacuum drying equipment (VCD)

This equipment is specially designed for precision coating matching processes, which can efficiently achieve uniform and stable drying and curing of the coating film layer. The matching coating production line realizes a closed-loop process for the entire process.

Features of the equipment
◆ Room temperature vacuum, no heating, slow and gentle desolvation, no thermal stress

Equipment highlights

◆ Zero deformation, no damage to substrate ◆ Excellent film surface quality

◆ Low cost and low energy consumption equipment ◆ High process fault tolerance



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Product Application

◆ Glass
◆ Perovskite research and development line
Low boiling point easily boiling solvent system

Technical parameters


Technical specifications and parameters

standard value

VCD

Substrate size

G2-G8.6

Material of the cavity

Stainless steel or aluminum (surface treatment)

pumping speed

10s@10Pa (According to customer requirements)

butterfly valve

Import or domestic preferred (according to customer requirements)

Dealing with warping

/

ultimate vacuum

≤1Pa

Dry pump

Import or domestic preferred (according to customer requirements)

heating temperature

/

temperature uniformity

/

Temperature control method

/


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FAQ


The wafer splitting machine equipment is used for the splitting process after laser cutting of wafers, with fully automated production. It can automatically identify and operate chips such as mirror, roughening, PSS, back metal plating, DBR chip processes, and ensure a splitting yield of over 98%.


A cutting device developed for large-format transparent and brittle materials, with a cutting range of 600mm×700mm.


  • A cutting device developed specifically for carbon fiber materials, capable of cutting, drilling and grooving composite materials such as carbon fiber, glass fiber and Kevlar. It can handle materials with a thickness ranging from 0.05mm to 1mm, and is applicable to the processing of display backplanes, mobile phone back shells, AR glasses shells, etc

  • A cutting device developed specifically for carbon fiber materials, capable of cutting, drilling and grooving composite materials such as carbon fiber, glass fiber and Kevlar. It can handle materials with a thickness ranging from 0.05mm to 1mm, and is applicable to the processing of display backplanes, mobile phone back shells, AR glasses shells, etc

  • A cutting device developed specifically for carbon fiber materials, capable of cutting, drilling and grooving composite materials such as carbon fiber, glass fiber and Kevlar. It can handle materials with a thickness ranging from 0.05mm to 1mm, and is applicable to the processing of display backplanes, mobile phone back shells, AR glasses shells, etc

  • Wide temperature-controlled process window, compatible with low to high temperature ranges; enables constant-rate etching to ensure stability and consistency in batch processing
  • Long chemical solution service life, eliminating the need for frequent replacement and reducing operational costs
This device supports regular characters, one-dimensional/two-dimensional codes, and 59mm、1018Marking with mm dot matrix pattern. The marking font can be scaled based on SEMI standards, and the character content can be flexibly customized. It is equipped with dual modes of ID wafer edge marking and DIE single-chip independent marking, suitable for precision wafer marking processing.