Semiconductor packaging coating machine

The PKG series high-performance slit coating machine has ultimate film formation uniformity, top-notch coating accuracy, high consumables utilization rate, and stable and durable long-term continuous operation of the whole machine. The equipment can integrate EFEM to achieve integrated production of substrate coating, HVCD, and HP/CP processes. Deep collaboration among various processes significantly improves the overall production efficiency of the production line.

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Semiconductor packaging coating machine
Semiconductor packaging coating machine
Semiconductor packaging coating machine

The PKG series high-performance slit coating machine has ultimate film formation uniformity, top-notch coating accuracy, high consumables utilization rate, and stable and durable long-term continuous operation of the whole machine. The equipment can integrate EFEM to achieve integrated production of substrate coating, HVCD, and HP/CP processes. Deep collaboration among various processes significantly improves the overall production efficiency of the production line.

◆ Fluid precision closed-loop control: high-precision metering pump precision slit die, closed-loop fluid control material;

◆ Wide viscosity adaptation: 1-2000cP, compatible with PR, PSPI, AL, RL;

Large area continuous flat film formation: 310-600mm square panel, supporting warping;


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Technical parameters


Technical specifications and parameters

standard value

Substrate size

310×310mm；515×510mm；600×600mm

Substrate type

Glass/Stainless Steel/EMC

Corresponding warpage

≤7mm

Substrate thickness

0.2-1.1mm

Loading and unloading method

manual

Wet film thickness

5~25um

Coating uniformity

≤ 5% (depending on the condition of the medication)

Coating effective area

10mm apart from the edge

Viscosity range

1~2000cp


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The wafer splitting machine equipment is used for the splitting process after laser cutting of wafers, with fully automated production. It can automatically identify and operate chips such as mirror, roughening, PSS, back metal plating, DBR chip processes, and ensure a splitting yield of over 98%.


A cutting device developed for large-format transparent and brittle materials, with a cutting range of 600mm×700mm.


  • A cutting device developed specifically for carbon fiber materials, capable of cutting, drilling and grooving composite materials such as carbon fiber, glass fiber and Kevlar. It can handle materials with a thickness ranging from 0.05mm to 1mm, and is applicable to the processing of display backplanes, mobile phone back shells, AR glasses shells, etc

  • A cutting device developed specifically for carbon fiber materials, capable of cutting, drilling and grooving composite materials such as carbon fiber, glass fiber and Kevlar. It can handle materials with a thickness ranging from 0.05mm to 1mm, and is applicable to the processing of display backplanes, mobile phone back shells, AR glasses shells, etc

  • A cutting device developed specifically for carbon fiber materials, capable of cutting, drilling and grooving composite materials such as carbon fiber, glass fiber and Kevlar. It can handle materials with a thickness ranging from 0.05mm to 1mm, and is applicable to the processing of display backplanes, mobile phone back shells, AR glasses shells, etc

  • Wide temperature-controlled process window, compatible with low to high temperature ranges; enables constant-rate etching to ensure stability and consistency in batch processing
  • Long chemical solution service life, eliminating the need for frequent replacement and reducing operational costs
This device supports regular characters, one-dimensional/two-dimensional codes, and 59mm、1018Marking with mm dot matrix pattern. The marking font can be scaled based on SEMI standards, and the character content can be flexibly customized. It is equipped with dual modes of ID wafer edge marking and DIE single-chip independent marking, suitable for precision wafer marking processing.