Flat panel display coating machine

Introducing high-performance slit coating equipment for FPD mass production scenarios in flat panel displays, suitable for large-scale continuous production;

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Flat panel display coating machine
Flat panel display coating machine
Flat panel display coating machine

Introducing high-performance slit coating equipment for FPD mass production scenarios in flat panel displays, suitable for large-scale continuous production; It has core advantages such as ultra-high film-forming accuracy, excellent film uniformity, low raw material loss, and long-term stable and reliable operation. We can provide a complete set of integrated solutions for slit coating host vacuum drying VCD pre baking HP.


High precision fluid control membrane system: high-precision metering pump, precision slit die, closed-loop fluid control material;

◆ Multi process formula storage: Built in multiple sets of coating speed, pump pressure, and gap parameter programs, quickly switching between different liquid medicine processes for OLED, LCD, and optical films.

Highlights:

Excellent uniformity of film layer, significantly improving yield

High material utilization rate, reducing consumable costs

◆ Low defect, suitable for high-end precision displays

◆ Integrated vacuum drying and temperature control unit



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Technical parameters


Technical specifications and parameters

standard value

Substrate size

G2-G8.6

Substrate type

glass

Substrate thickness

0.4-3mm

Loading and unloading method

manual

Wet film thickness

5~25um

Coating uniformity

≤3%

Coating effective area

10mm apart from the edge

Viscosity range

1~100cp


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The wafer splitting machine equipment is used for the splitting process after laser cutting of wafers, with fully automated production. It can automatically identify and operate chips such as mirror, roughening, PSS, back metal plating, DBR chip processes, and ensure a splitting yield of over 98%.


A cutting device developed for large-format transparent and brittle materials, with a cutting range of 600mm×700mm.


  • A cutting device developed specifically for carbon fiber materials, capable of cutting, drilling and grooving composite materials such as carbon fiber, glass fiber and Kevlar. It can handle materials with a thickness ranging from 0.05mm to 1mm, and is applicable to the processing of display backplanes, mobile phone back shells, AR glasses shells, etc

  • A cutting device developed specifically for carbon fiber materials, capable of cutting, drilling and grooving composite materials such as carbon fiber, glass fiber and Kevlar. It can handle materials with a thickness ranging from 0.05mm to 1mm, and is applicable to the processing of display backplanes, mobile phone back shells, AR glasses shells, etc

  • A cutting device developed specifically for carbon fiber materials, capable of cutting, drilling and grooving composite materials such as carbon fiber, glass fiber and Kevlar. It can handle materials with a thickness ranging from 0.05mm to 1mm, and is applicable to the processing of display backplanes, mobile phone back shells, AR glasses shells, etc

  • Wide temperature-controlled process window, compatible with low to high temperature ranges; enables constant-rate etching to ensure stability and consistency in batch processing
  • Long chemical solution service life, eliminating the need for frequent replacement and reducing operational costs
This device supports regular characters, one-dimensional/two-dimensional codes, and 59mm、1018Marking with mm dot matrix pattern. The marking font can be scaled based on SEMI standards, and the character content can be flexibly customized. It is equipped with dual modes of ID wafer edge marking and DIE single-chip independent marking, suitable for precision wafer marking processing.