Heating equipment (HP/CP)

This device supports G2.5~G8.6 large substrates and can be used for pre curing, annealing crystallization, and high-temperature baking curing of various thin films. HP proximity planar conduction heating, precise temperature control in different zones; The CP water-cooled constant temperature platform achieves rapid and uniform cooling, stable heat transfer, and is suitable for production lines and laboratory research and development.

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Heating equipment (HP/CP)
Heating equipment (HP/CP)
Heating equipment (HP/CP)

This device supports G2.5~G8.6 large substrates and can be used for pre curing, annealing crystallization, and high-temperature baking curing of various thin films. HP proximity planar conduction heating, precise temperature control in different zones; The CP water-cooled constant temperature platform achieves rapid and uniform cooling, stable heat transfer, and is suitable for production lines and laboratory research and development.

HP adopts proximity contact planar conduction heating and precise temperature control across the entire platform; The temperature zone is segmented and independently controlled, with a dust-free and clean chamber. The temperature range is adjustable from room temperature to 250 ℃, with a global temperature difference of ≤± 3 ℃;

CP water-cooled constant temperature contact cooling platform, with a constant temperature range of 20-25 ℃ at room temperature, can adsorb and fix the substrate for rapid and uniform cooling;



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Product Application

Pre curing or annealing crystallization;

PR, PI, PSPI, RL, AL, PVK, ETL, HTL high-temperature baking curing;

G2.5~G8 large-scale continuous production line and laboratory research and development;

Technical parameters


Technical specifications and parameters

standard value

Remarks

Substrate size

G2~G8.6 (customized by customers)

heating temperature

Room temperature~250 ℃

temperature uniformity

±2℃（@150°）； ±3℃（@220℃）

Multi zone heating, optional upper plate heating

contact method

Proximity contact

Hot hair dryer

Optional

Corresponding warpage

≤ 7mm (optional)

Temperature control method

PID

Cooling temperature

23 ± 2 ℃ (constant temperature environment)

cooling method

Water cooling cycle


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